Temperature control for chemical mechanical polishing

• Main Authors: SUNDARRAJAN, HARI, ZHANG SHOUCHENG, SEKINE TAKETO, YANG YANZHU, SHEN SHIHAO, TANG JIANSHE, WU HAOSHENG
• Format: Patent
• Language: Chinese; English
• Published: 12.01.2024
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

A chemical mechanical polishing system includes a support holding a polishing pad, a carrier head holding a substrate against the polishing pad during a polishing process, an in-situ monitoring system configured to generate a signal indicative of an amount of material on the substrate, a temperature...