Package and method of forming same

• Main Authors: XIA XINGGUO, CHAO RUILIN, ZENG ZHIWEI, YU ZHENHUA
• Format: Patent
• Language: Chinese; English
• Published: 09.01.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; SEMICONDUCTOR DEVICES

In accordance with an embodiment of the present application, a method for forming a package includes encapsulating a first device die and a second device die in an encapsulant, and forming an interconnect structure over the first device die and the second device die electrically connected to the fir...