Package and method of forming same
In accordance with an embodiment of the present application, a method for forming a package includes encapsulating a first device die and a second device die in an encapsulant, and forming an interconnect structure over the first device die and the second device die electrically connected to the fir...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
09.01.2024
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Subjects | |
Online Access | Get full text |
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