Package and method of forming same

• Main Authors: XIA XINGGUO, CHAO RUILIN, ZENG ZHIWEI, YU ZHENHUA
• Format: Patent
• Language: Chinese; English
• Published: 09.01.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; SEMICONDUCTOR DEVICES

In accordance with an embodiment of the present application, a method for forming a package includes encapsulating a first device die and a second device die in an encapsulant, and forming an interconnect structure over the first device die and the second device die electrically connected to the first device die and the second device die. A waveguide is formed in the interconnect structure. An optical engine-based interconnect assembly is bonded to the interconnect structure. The optical engine-based interconnect assembly forms part of a signal path connecting the first device die to the second device die. In accordance with other embodiments of the present application, a package is also provided. 根据本申请的实施例，提供了一种用于形成封装件的方法包括将第一器件管芯和第二器件管芯封装在密封剂中，以及在第一器件管芯和第二器件管芯上方形成电连接到第一器件管芯和第二器件管芯的互连结构。在互连结构中形成波导。基于光学引擎的互连组件接合到互连结构。基于光学引擎的互连组件形成将第一器件管芯连接到第二器件管芯的信号路径的部分。根据本申请的其他实施例，还提供了封装件。