SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND DRYING PROCESSING LIQUID

• Main Authors: NAMIKAWA TAKASHI, HOSODA KAZUKI, KOBAYASHI KENJI, ISHIZU TAKEAKI, OTA TAKASHI
• Format: Patent
• Language: Chinese; English
• Published: 12.12.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

This substrate processing method is provided with: a step (step S11) in which a chemical solution is supplied to the surface of a substrate; a step (step S12) in which a rinsing liquid is supplied to the surface of the substrate after the step S11; a step (step S14) in which, after the step S12, the...