SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND DRYING PROCESSING LIQUID

• Main Authors: NAMIKAWA TAKASHI, HOSODA KAZUKI, KOBAYASHI KENJI, ISHIZU TAKEAKI, OTA TAKASHI
• Format: Patent
• Language: Chinese; English
• Published: 12.12.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

This substrate processing method is provided with: a step (step S11) in which a chemical solution is supplied to the surface of a substrate; a step (step S12) in which a rinsing liquid is supplied to the surface of the substrate after the step S11; a step (step S14) in which, after the step S12, the heated drying treatment liquid is brought into contact with the surface of the substrate; and a step (step S15) for drying the substrate by removing the drying treatment liquid from the surface of the substrate after the step S14. The surface tension of the drying treatment liquid is lower than the surface tension of the rinsing liquid. The boiling point of the drying treatment liquid is higher than that of the rinsing liquid. In step S14, the temperature of the drying treatment liquid contacting the surface of the substrate is a predetermined contact temperature that is not less than the boiling point of the rinsing liquid but less than the boiling point of the drying treatment liquid. Consequently, it is possibl