Preparation method of ultrathin wafer and wafer

• Main Authors: YUAN PENGYUE, YAN ZHUO, MO RONGZHEN, HUANG ZEJUN
• Format: Patent
• Language: Chinese; English
• Published: 01.12.2023
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

The invention discloses a preparation method of an ultrathin wafer and the wafer. The method comprises the steps that the wafer to be thinned is flatly laid on a tool table top, and the back surface of the wafer is directly placed on the tool table top; correspondingly adhering one side surface of the adhesive layer of the photosensitive buffer film to the forward surface of the wafer; correspondingly adhering one side surface of a rigid carrier to the other side surface of the adhesive layer, wherein the other side surface of the rigid carrier is exposed and faces upwards; the exposed surface of the rigid carrier is directly placed on a tool table top so that the back surface of the wafer can be exposed and face upwards; grinding and thinning the wafer downwards along the height direction from the back surface of the wafer; projecting ultraviolet light to the photosensitive buffer film to enable the photosensitive buffer film to generate adhesive force transmutation and to be separated from the rigid carrier