Chip interconnection hole metallization activator and preparation method and application thereof

• Main Authors: LUO JINGLI, YE CHUNYI, FU XIANZHU
• Format: Patent
• Language: Chinese; English
• Published: 14.11.2023
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The invention discloses a chip interconnection hole metallization activator and a preparation method and application thereof.The preparation method comprises the steps that one of PVP, oleic acid, oleylamine, ethylene diamine tetraacetic acid and potassium ferrocyanide, one of CTAB and tetra-n-octyl...