Chip interconnection hole metallization activator and preparation method and application thereof

• Main Authors: LUO JINGLI, YE CHUNYI, FU XIANZHU
• Format: Patent
• Language: Chinese; English
• Published: 14.11.2023
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The invention discloses a chip interconnection hole metallization activator and a preparation method and application thereof.The preparation method comprises the steps that one of PVP, oleic acid, oleylamine, ethylene diamine tetraacetic acid and potassium ferrocyanide, one of CTAB and tetra-n-octyl ammonium bromide and copper sulfate pentahydrate are added into deionized water and stirred, and a mixture is obtained; after the solid is completely dissolved, adding lactic acid or dilute sulphuric acid, mixing to obtain a mixed solution, and transferring the mixed solution to a water bath at a preset temperature for heat preservation; adding sodium hypophosphite monohydrate, hydrazine hydrate or sodium borohydride into deionized water, and stirring to prepare a reducing agent solution; and adding the reducing agent solution into the mixed solution, carrying out a reaction under a water bath condition at a predetermined temperature, and obtaining the chip interconnection hole metallization activator when the rea