Lead frame material, manufacturing method thereof, and semiconductor package

• Main Authors: HASHIMOTO SHIN, OUCHI KAZUHIRO, KUZUHARA SAKI
• Format: Patent
• Language: Chinese; English
• Published: 10.11.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Provided are: a lead frame material which exhibits excellent adhesion to a resin even when used for a long period of time in a high-temperature and high-humidity environment, and which is not susceptible to powder falling; a method for producing the lead frame material; and a semiconductor package using the lead frame material. The lead frame material (1) has a conductive base body (10) and a surface coating film (30) formed on at least a part of the surface of the base body (10), the surface coating film (30) includes at least one roughened layer (3), and the space volume (Vv) and the solid volume (Vmp) of the protruding part when the surface properties are measured by a laser roughening instrument are respectively in the range of 0.6 cm < 3 >/m2 to 5.1 cm < 3 >/m2 and in the range of 0.02 cm < 3 >/m2 to 0.30 cm < 3 >/m2. 提供即使在高温高湿的环境下经长时间使用的情况下与树脂的密合性也优异、且不易发生落粉的引线框架材料及其制造方法、以及使用其的半导体封装。引线框架材料1具有导电性的基体10、和在基体10的表面的至少一部分形成的表面被膜30，表面被膜30包含至少1层的粗糙化层3，且用激光粗糙度仪对表面性状进行测定时的空间体积(Vv)及突出部实体体积(Vmp)分别在0.6cm3/m2以上5.1cm3