Light emitting diode and light emitting device

The invention relates to the technical field of semiconductor manufacturing, in particular to a light-emitting diode which comprises a semiconductor lamination layer, a first electrode, an alloy layer, a second electrode and an insulating layer, the semiconductor lamination layer comprises a first s...

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Main Authors ZHOU JIAHUI, CAI JIMING, LAN YONGLING, ZHANG ZHONGYING, LONG SIYI, JIANG BIN, ZENG WEIJUN, ZANG YASHU, CHEN SIHE, YANG ZHONGJIE, CHEN GONG, HUANG SHAOHUA, ZHANG WEI, ZHANG GUOHUA
Format Patent
LanguageChinese
English
Published 10.11.2023
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Abstract The invention relates to the technical field of semiconductor manufacturing, in particular to a light-emitting diode which comprises a semiconductor lamination layer, a first electrode, an alloy layer, a second electrode and an insulating layer, the semiconductor lamination layer comprises a first semiconductor layer, a light-emitting layer and a second semiconductor layer which are sequentially laminated, the first electrode is located on the first semiconductor layer, and the second electrode is located on the second semiconductor layer. The alloy layer is located on the second semiconductor layer, the second electrode covers the alloy layer, the insulating layer covers the semiconductor laminated layer, the first electrode and the second electrode, the second electrode is of a multi-layer metal structure, the surface layer, connected with the second semiconductor layer, of the second electrode is a first adhesion layer, and the surface layer, connected with the insulating layer, of the second electrode is
AbstractList The invention relates to the technical field of semiconductor manufacturing, in particular to a light-emitting diode which comprises a semiconductor lamination layer, a first electrode, an alloy layer, a second electrode and an insulating layer, the semiconductor lamination layer comprises a first semiconductor layer, a light-emitting layer and a second semiconductor layer which are sequentially laminated, the first electrode is located on the first semiconductor layer, and the second electrode is located on the second semiconductor layer. The alloy layer is located on the second semiconductor layer, the second electrode covers the alloy layer, the insulating layer covers the semiconductor laminated layer, the first electrode and the second electrode, the second electrode is of a multi-layer metal structure, the surface layer, connected with the second semiconductor layer, of the second electrode is a first adhesion layer, and the surface layer, connected with the insulating layer, of the second electrode is
Author YANG ZHONGJIE
ZHOU JIAHUI
JIANG BIN
CHEN SIHE
CAI JIMING
ZHANG WEI
ZENG WEIJUN
ZHANG ZHONGYING
LONG SIYI
ZANG YASHU
CHEN GONG
LAN YONGLING
ZHANG GUOHUA
HUANG SHAOHUA
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– fullname: JIANG BIN
– fullname: ZENG WEIJUN
– fullname: ZANG YASHU
– fullname: CHEN SIHE
– fullname: YANG ZHONGJIE
– fullname: CHEN GONG
– fullname: HUANG SHAOHUA
– fullname: ZHANG WEI
– fullname: ZHANG GUOHUA
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DocumentTitleAlternate 发光二极管及发光装置
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Snippet The invention relates to the technical field of semiconductor manufacturing, in particular to a light-emitting diode which comprises a semiconductor lamination...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Light emitting diode and light emitting device
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