Embedded radio frequency module and chip packaging method thereof

• Main Authors: CHENG ZHENGGUO, XU WENHUA, XIN ZHENGYAN, NI WENHAI
• Format: Patent
• Language: Chinese; English
• Published: 27.10.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to an embedded radio frequency module and a chip packaging method thereof, and the method comprises the steps: generating a metal column on a substrate, and enabling a non-filter chip to be mounted on the substrate; continuously generating a substrate and a metal layer, embedding the non-filter chip, and leading out a pin of the non-filter chip through the metal layer; welding the filter chip on the substrate, and enabling the salient points of the filter chip to be connected with the welding spots arranged on the metal layer; and generating a sealing layer on the side, where the filter chip is arranged, of the substrate. The non-filter chip is embedded, so that the two-dimensional area of the whole module chip is saved, the size of the module chip is greatly reduced, and the manufacturing cost is reduced. 本申请涉及一种内埋式射频模组及其芯片封装方法，该方法包括：在衬底上生成金属柱，并将非滤波器芯片贴装到衬底上；继续生成衬底和金属层，将非滤波器芯片内埋，并通过金属层将非滤波器芯片的引脚引出；将滤波器芯片焊接在衬底上，并使滤波器芯片的凸点与金属层上设置的焊点连接；在衬底设置滤波器芯片的一侧生成密封层。通过将非滤波器芯片内埋，节省整个模组芯片的二维面积，大大缩小了模组芯片