Blind hole multilayer circuit board and preparation method thereof
The invention relates to the technical field of circuit boards, in particular to a blind hole multilayer circuit board and a preparation method thereof. Copper foil layers on the two sides of a copper-clad plate are selectively etched to obtain conductive circuits, a through hole is formed in an ins...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
03.10.2023
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Subjects | |
Online Access | Get full text |
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