Blind hole multilayer circuit board and preparation method thereof

• Main Authors: LIAO WEIGUANG, FANG ZHAOPING, CHO WANG HYUN
• Format: Patent
• Language: Chinese; English
• Published: 03.10.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The invention relates to the technical field of circuit boards, in particular to a blind hole multilayer circuit board and a preparation method thereof. Copper foil layers on the two sides of a copper-clad plate are selectively etched to obtain conductive circuits, a through hole is formed in an insulating layer in a penetrating mode, a conductive material is electroplated on the through hole, the conductive circuits on the two sides of the insulating layer are communicated through the through hole, and a circuit substrate A is prepared. Taking the insulating layer as a blind hole penetrating layer, and sequentially laminating and pressing the copper foil, the blind hole penetrating layer, the circuit substrate A, the insulating layer, the circuit substrate A, the blind hole penetrating layer and the copper foil from top to bottom to obtain a finished product. Wherein the insulating layer is prepared by dipping glass fiber gridding cloth in dispersion liquid composed of pretreated nano silicon dioxide, phthal