Precise slitting machine for ceramic circuit substrate

• Main Authors: ZHAO PENG, JIANG XIANGHUA, ZHENG HUAYAN, YANG XUETAI, TONG YANGFAN, TANG XIAOKANG, ZOU YANGWEN, ZHENG HUIRONG
• Format: Patent
• Language: Chinese; English
• Published: 05.09.2023
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention discloses a precise slitting machine for a ceramic circuit substrate, and relates to the field of slitting machines.The precise slitting machine comprises a machine base, a mechanical arm is arranged at the top of the machine base, a laser welding head is installed at one end of the mechanical arm, a clamping assembly is arranged at the top end of the machine base, and the clamping assembly comprises two installation blocks; two adjusting sliding blocks are mounted at the top end of the mounting block through sliding rails, and L-shaped plates are fixedly arranged at the top ends of the adjusting sliding blocks. Ceramic circuit substrates are neatly clamped and fixed from top to bottom through the clamping assemblies, so that the cutting paths of the ceramic circuit substrates are the same and coincide, then laser cutting is carried out, and even if a laser beam penetrates through the uppermost circuit substrate in the cutting process, the cutting path of the ceramic circuit substrates is not ch