Scraper knife and method for dewaxing silicon carbide wafer by using same

• Main Authors: WU LU, WANG LIAOKUO, GAO BING, WEI ZHEFENG
• Format: Patent
• Language: Chinese; English
• Published: 04.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

The invention belongs to the technical field of semiconductor wafer processing, and particularly relates to a scraper knife and a method for dewaxing a silicon carbide wafer by using the scraper knife. The scraper knife comprises a knife head which is gradually thinned from the near end to the far e...