Scraper knife and method for dewaxing silicon carbide wafer by using same

• Main Authors: WU LU, WANG LIAOKUO, GAO BING, WEI ZHEFENG
• Format: Patent
• Language: Chinese; English
• Published: 04.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

The invention belongs to the technical field of semiconductor wafer processing, and particularly relates to a scraper knife and a method for dewaxing a silicon carbide wafer by using the scraper knife. The scraper knife comprises a knife head which is gradually thinned from the near end to the far end, can be bent and is used for shoveling wax near a silicon carbide wafer; the cutter handle unit is arranged on the near end side of the cutter head and used for controlling the moving process of the cutter head; a cutting edge for removing wax is formed at the far end of the tool bit; the cutting edge is provided with a cutting edge groove matched with the edge radian of the silicon carbide wafer; and the tool bit is prepared from polyformaldehyde resin. The tool bit of the scraper knife can be bent, so that the cutting edge of the tool bit is always attached to the bearing disc during wax shoveling, and the possibility that the cutting edge possibly scratches the surface of the wafer in the shoveling process is