Polyimide precursor, polyimide and preparation method and application thereof

• Main Authors: LYU XIALEI, ZHANG GUOPING, HUANG SHAN, LI JINHUI, SUN RONG
• Format: Patent
• Language: Chinese; English
• Published: 25.07.2023
• Subjects: ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM; APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTROGRAPHY; HETEROCYCLIC COMPOUNDS; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC CHEMISTRY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; THEIR PREPARATION OR CHEMICAL WORKING-UP

The invention discloses a polyimide precursor, polyimide and a preparation method and application thereof. The structure of the flexible diamine is as shown in the formula (I). Wherein the polyimide precursor is obtained by polycondensation or copolymerization of diamine and aromatic tetracarboxylic dianhydride; the diamine comprises the flexible diamine. The polyimide is obtained by curing a polyimide precursor. The invention also discloses the photosensitive resin which comprises the polyimide precursor and the photosensitive monomer. Alkaline diamine with different side groups and flexible bridging groups is used as a reaction monomer of the polyimide precursor, so that the free volume and the degree of freedom of a polymer chain are increased, direct polymerization or copolymerization with acid anhydride is easier, and the imidization rate of the polyimide precursor at 200 DEG C is remarkably improved. Meanwhile, the side groups with different free volumes and rigidities can adjust the interaction among p