Plate type heat exchanger and process for manufacturing same

• Main Author: KURE TETSU,NAKAHYO SHUHEI,KOMAKI TOMIO
• Format: Patent
• Language: Chinese; English
• Published: 25.08.2004
• Edition: 7
• Subjects: BLASTING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION; HEAT EXCHANGE IN GENERAL; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEATING; LIGHTING; MACHINE TOOLS; MECHANICAL ENGINEERING; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WEAPONS; WELDING; WORKING BY LASER BEAM

一种板式热交换器，包括具有许多传热板层迭结构布置的一板组件，各传热板之间留有间隔，以构成相邻传热板之间的传热介质通道，还具有许多接触部位；此外该板式热交换器还包括放置在相邻传热板之间的焊料，并且焊接它们之间的接触部位，完全将传热板焊接起来形成板组件，选择一个允许第一传热介质流过的传热介质通道和允许第二传热介质流过的另一传热介质通道，因此当第一和第二传热介质流经传热板时，在它们之间实现热交换；焊接相邻传热板确定了第一个传热介质通道的焊料具有适合于第一种传热介质的特性，并且焊接相邻传热板确定了第二个传热介质通道的焊料具有适合于第二种传热介质的特性，其中，第一传热介质是非腐蚀性流体，第二传热介质是腐蚀性流体。 Plate heat exchanger (10) comprising a plate assembly (12) having a plurality of heat transfer plates (30) arranged in a stack formation wherein the plates (30) are spaced apart from each other to define heat transfer medium passages between adjacent heat transfer plates. The plate (30) has a plurality of contact portions. The plate heat exchanger (10) further comprises solder (54,56) disposed between and joining the contact portions of the adjacent heat transfer plates (30) so as to integrally join the heat transfer plates (30) thereby forming the plate assembly (12). Selected ones of the heat transfer medium passages allow a first heat transfer medium to flow therethrough and other heat transfer medium passages allow a second heat transfer medium to flow therethrough to thereby enable heat exchange to be effected between the first and second heat transfer media via the heat transfer plates (30). The solder (54) joins the adjacent heat transfer plates (30) which define the first heat transfer medium passage has characteristics suitable for the first heat transfer medium. The solder (56) joining the adjacent heat transfer plates (30) which define the second heat transfer medium passage has characteristics suitable for the second heat transfer medium.