Multi-view wafer analysis

• Main Authors: GOLANI OFER, ALLARD STEPHANE, ALMOG ITAI, NESTEN ELENA, ILAN HASSAN, FELDMANN HOLGER
• Format: Patent
• Language: Chinese; English
• Published: 30.06.2023
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; TESTING

A method for detecting defects on a sample is disclosed herein. The method comprises the following steps: obtaining scanning data of an area of a sample in multiple view angles; and performing confluence analysis on the obtained scan data. The confluence analysis includes: calculating a cross-view c...