Multi-view wafer analysis

• Main Authors: GOLANI OFER, ALLARD STEPHANE, ALMOG ITAI, NESTEN ELENA, ILAN HASSAN, FELDMANN HOLGER
• Format: Patent
• Language: Chinese; English
• Published: 30.06.2023
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; TESTING

A method for detecting defects on a sample is disclosed herein. The method comprises the following steps: obtaining scanning data of an area of a sample in multiple view angles; and performing confluence analysis on the obtained scan data. The confluence analysis includes: calculating a cross-view covariance based on the obtained scan data, and/or estimating a cross-view covariance; and determining the presence of a defect in the region taking into account the cross-view covariance. 本文中公开了一种用于检测样本上的缺陷的方法。所述方法包括以下步骤：获得多重视角中的样本的区域的扫描数据；以及执行对获得的扫描数据的整合分析。整合分析包括：基于获得的扫描数据来计算跨视角协方差，和/或估计跨视角协方差；以及在考虑到跨视角协方差的情况下，确定区域中的缺陷的存在。