Supporting assembly and preparation method thereof, display assembly and electronic equipment
The invention provides a supporting assembly and a preparation method thereof, a display assembly and electronic equipment. The supporting assembly comprises a supporting piece and a heat conduction piece, the supporting piece is provided with a bending area and a non-bending area, the supporting pi...
Saved in:
Main Authors | , , , , , , , , , |
---|---|
Format | Patent |
Language | Chinese English |
Published |
23.06.2023
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | The invention provides a supporting assembly and a preparation method thereof, a display assembly and electronic equipment. The supporting assembly comprises a supporting piece and a heat conduction piece, the supporting piece is provided with a bending area and a non-bending area, the supporting piece located in the bending area is provided with at least one through hole, and the heat conduction piece is arranged in the through hole. According to the supporting assembly, the heat conduction part is additionally arranged in the through hole formed in the supporting part of the bending area, the heat conduction sectional area of the bending area is increased through the excellent heat conduction performance of the heat conduction part, and therefore the heat conduction efficiency of heat on the two sides of the bending area is improved, the heat dissipation performance of the supporting assembly is improved, and the user experience is improved.
本申请提供了支撑组件及其制备方法、显示组件、电子设备。其中,支撑组件包括支撑件与导热件,所述支撑件具有弯折区与非弯折区,位于所述弯折 |
---|---|
AbstractList | The invention provides a supporting assembly and a preparation method thereof, a display assembly and electronic equipment. The supporting assembly comprises a supporting piece and a heat conduction piece, the supporting piece is provided with a bending area and a non-bending area, the supporting piece located in the bending area is provided with at least one through hole, and the heat conduction piece is arranged in the through hole. According to the supporting assembly, the heat conduction part is additionally arranged in the through hole formed in the supporting part of the bending area, the heat conduction sectional area of the bending area is increased through the excellent heat conduction performance of the heat conduction part, and therefore the heat conduction efficiency of heat on the two sides of the bending area is improved, the heat dissipation performance of the supporting assembly is improved, and the user experience is improved.
本申请提供了支撑组件及其制备方法、显示组件、电子设备。其中,支撑组件包括支撑件与导热件,所述支撑件具有弯折区与非弯折区,位于所述弯折 |
Author | QIU WEIBIN LI DA LIU SHILIN TIAN BOXIN TANI IPPEI SUN LONGWEI PANG JINGHUA LIAO BINCAI MA RUYI LI ZHI |
Author_xml | – fullname: QIU WEIBIN – fullname: LI ZHI – fullname: LI DA – fullname: SUN LONGWEI – fullname: TIAN BOXIN – fullname: LIU SHILIN – fullname: PANG JINGHUA – fullname: TANI IPPEI – fullname: LIAO BINCAI – fullname: MA RUYI |
BookMark | eNqNy60OwjAUhuEKEPzdQ_EguiV4skBQGLBkOWzfWJPunEPbid09BoNDveZ5l2bGwliYx21UlZg9vyylhOEZJkvcWo1QipS9sB2Qe2lt7hEh3c62Pmmg6XdAQJOjsG8s3qPXAZzXZt5RSNh8uzLb8-leXfZQqZGUGjByXV2dO5SuKAp3LP8xH7dOPr4 |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences Education Physics |
DocumentTitleAlternate | 支撑组件及其制备方法、显示组件、电子设备 |
ExternalDocumentID | CN116312221A |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_CN116312221A3 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 13:55:27 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | Chinese English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_CN116312221A3 |
Notes | Application Number: CN202211088110 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230623&DB=EPODOC&CC=CN&NR=116312221A |
ParticipantIDs | epo_espacenet_CN116312221A |
PublicationCentury | 2000 |
PublicationDate | 20230623 |
PublicationDateYYYYMMDD | 2023-06-23 |
PublicationDate_xml | – month: 06 year: 2023 text: 20230623 day: 23 |
PublicationDecade | 2020 |
PublicationYear | 2023 |
RelatedCompanies | OPPO GUANGDONG MOBILE TELECOMMUNICATIONS CO., LTD |
RelatedCompanies_xml | – name: OPPO GUANGDONG MOBILE TELECOMMUNICATIONS CO., LTD |
Score | 3.6099255 |
Snippet | The invention provides a supporting assembly and a preparation method thereof, a display assembly and electronic equipment. The supporting assembly comprises a... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | ADVERTISING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CRYPTOGRAPHY DISPLAY DISPLAYING EDUCATION ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LABELS OR NAME-PLATES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEALS SIGNS |
Title | Supporting assembly and preparation method thereof, display assembly and electronic equipment |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230623&DB=EPODOC&locale=&CC=CN&NR=116312221A |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1NS8NAEB1q_bxpVLR-sILkZLBJGu0egthNSxGaFqnSi5RkM9FKTWKTIvXXu5umVg963bBLMjCZt7tv3gM4pxQxpEZdCwzKtRrHQKMWSj_i0NN56AcWynPIjnvVfqjdDaxBCV4XvTC5TuhHLo4oMoqLfM_y_3WyPMRycm5leumPxFB80-rbjlrsjiWeNkzVadjNXtfpMpUxm7mqe2_rAnfoohbqtyuwKmG01NlvPjZkV0rys6S0tmGtJ1aLsh0ofb4osMkWzmuKdFIuWBcKbHSKy28F1nO2Jk_FYJGR6S48SVvOWEoBPBOBg_HNH8-IFwUkmeBc1juOyNwmmkish3F4QYJRmoy92e8JS0Mcgu_TUc4j2oOzVrPP2pp4--F3qIbMXX6ouQ_lKI7wAIhHsc4tsXO79qu1oCowikmRepbuoW7yengIlb_Xqfz38Ai2ZNglecowj6GcTaZ4Isp05p_m8f0C0kyZGg |
link.rule.ids | 230,309,786,891,25594,76903 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1bT8IwFD5BvOCbTo3irSZmTy6yjQl9WIxsEFQYxKDhhZCt6xSD22QjBn-9bRmiD_rapk0vOT3fab-eD-AcY0oDrFUVX8NEKRPqK9igXI84cFUSeL5B-T1k27lqPpbv-kY_B6-LvzAiT-iHSI7ILIowe0_FeR0vL7Fswa1MLr0RK4quGz3TlrPomONpTZftmlnvduyOJVuWaTmy82CqDHeozBeqNyuwWmEhoQiVnmr8V0r806U0tmCty3oL023Ifb5IULAWymsSV1LOWBcSbLSzx28J1gVbkySsMLPIZAcGXJYz4qkAnhHDwfTNG8-QG_oontB5Wu8oRHOZaMSxHo2CC-SPknjszn43WAriIPo-HQke0S6cNeo9q6mw0Q-_l2poOcuJ6nuQD6OQ7gNyMa0Sg0VuFa9U9ksMo-iYYtdQXarqpBocQPHvfor_VZ5Codlrt4atW-f-EDb5FnAilaYfQT6dTOkxc9mpdyLW-gsgwJwE |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Supporting+assembly+and+preparation+method+thereof%2C+display+assembly+and+electronic+equipment&rft.inventor=QIU+WEIBIN&rft.inventor=LI+ZHI&rft.inventor=LI+DA&rft.inventor=SUN+LONGWEI&rft.inventor=TIAN+BOXIN&rft.inventor=LIU+SHILIN&rft.inventor=PANG+JINGHUA&rft.inventor=TANI+IPPEI&rft.inventor=LIAO+BINCAI&rft.inventor=MA+RUYI&rft.date=2023-06-23&rft.externalDBID=A&rft.externalDocID=CN116312221A |