Supporting assembly and preparation method thereof, display assembly and electronic equipment

The invention provides a supporting assembly and a preparation method thereof, a display assembly and electronic equipment. The supporting assembly comprises a supporting piece and a heat conduction piece, the supporting piece is provided with a bending area and a non-bending area, the supporting pi...

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Main Authors QIU WEIBIN, LI ZHI, LI DA, SUN LONGWEI, TIAN BOXIN, LIU SHILIN, PANG JINGHUA, TANI IPPEI, LIAO BINCAI, MA RUYI
Format Patent
LanguageChinese
English
Published 23.06.2023
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Abstract The invention provides a supporting assembly and a preparation method thereof, a display assembly and electronic equipment. The supporting assembly comprises a supporting piece and a heat conduction piece, the supporting piece is provided with a bending area and a non-bending area, the supporting piece located in the bending area is provided with at least one through hole, and the heat conduction piece is arranged in the through hole. According to the supporting assembly, the heat conduction part is additionally arranged in the through hole formed in the supporting part of the bending area, the heat conduction sectional area of the bending area is increased through the excellent heat conduction performance of the heat conduction part, and therefore the heat conduction efficiency of heat on the two sides of the bending area is improved, the heat dissipation performance of the supporting assembly is improved, and the user experience is improved. 本申请提供了支撑组件及其制备方法、显示组件、电子设备。其中,支撑组件包括支撑件与导热件,所述支撑件具有弯折区与非弯折区,位于所述弯折
AbstractList The invention provides a supporting assembly and a preparation method thereof, a display assembly and electronic equipment. The supporting assembly comprises a supporting piece and a heat conduction piece, the supporting piece is provided with a bending area and a non-bending area, the supporting piece located in the bending area is provided with at least one through hole, and the heat conduction piece is arranged in the through hole. According to the supporting assembly, the heat conduction part is additionally arranged in the through hole formed in the supporting part of the bending area, the heat conduction sectional area of the bending area is increased through the excellent heat conduction performance of the heat conduction part, and therefore the heat conduction efficiency of heat on the two sides of the bending area is improved, the heat dissipation performance of the supporting assembly is improved, and the user experience is improved. 本申请提供了支撑组件及其制备方法、显示组件、电子设备。其中,支撑组件包括支撑件与导热件,所述支撑件具有弯折区与非弯折区,位于所述弯折
Author QIU WEIBIN
LI DA
LIU SHILIN
TIAN BOXIN
TANI IPPEI
SUN LONGWEI
PANG JINGHUA
LIAO BINCAI
MA RUYI
LI ZHI
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– fullname: PANG JINGHUA
– fullname: TANI IPPEI
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– fullname: MA RUYI
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Snippet The invention provides a supporting assembly and a preparation method thereof, a display assembly and electronic equipment. The supporting assembly comprises a...
SourceID epo
SourceType Open Access Repository
SubjectTerms ADVERTISING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CRYPTOGRAPHY
DISPLAY
DISPLAYING
EDUCATION
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LABELS OR NAME-PLATES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
SEALS
SIGNS
Title Supporting assembly and preparation method thereof, display assembly and electronic equipment
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