Delayed curing pressure-sensitive adhesive, pressure-sensitive adhesive tape and preparation method thereof

• Main Authors: LI GEN, IMONO SHOZO, WU XIAOPING, WU XILAI, CHEN HONGYE
• Format: Patent
• Language: Chinese; English
• Published: 23.06.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

The invention relates to a delayed curing pressure-sensitive adhesive, a pressure-sensitive adhesive tape and a preparation method thereof, and belongs to the technical field of pressure-sensitive adhesives. The UV delayed curing pressure-sensitive adhesive disclosed by the invention is prepared from the following components in parts by weight: 10 to 90 parts of polymer film forming matrix, 20 to 70 parts of epoxy resin, 10 to 40 parts of diluent, 0.1 to 10 parts of photoinitiator, 0.1 to 10 parts of curing agent and 0.1 to 10 parts of auxiliary agent. The UV delayed curing pressure-sensitive adhesive prepared by the invention has good pressure sensitivity and wettability at the initial stage, has the bonding strength of a structural adhesive after delayed curing after being adhered by UV irradiation, is low in required equipment cost and high in operation efficiency, can be suitable for adhesion of an opaque base material and an adhered object, and can adjust an opening time window. 本发明涉及一种延迟固化压敏胶粘剂、压敏胶带及其制备