Hydrogen etching tool and method for silicon carbide wafer

• Main Authors: WANG CHUANYONG, SHENG YONGJIANG, OUYANG PENGGEN, WU YAOYAO, TANG YONGGANG, HUANG JUN, HU JIANRONG
• Format: Patent
• Language: Chinese; English
• Published: 06.06.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a silicon carbide wafer hydrogen etching tool and method, and belongs to the technical field of silicon carbide wafer hydrogen etching, and the silicon carbide wafer hydrogen etching tool comprises a shell and an etching assembly located in the shell. The etching assembly comprises a gas pipeline and a base, the gas pipeline penetrates through the shell and is opposite to the base, the base is provided with a fixed seat, the fixed seat has a first state and a second state, the upper end face of the fixed seat is a slightly convex interface in the first state so as to support the warped silicon carbide wafer, and the fixed seat is gradually softened in the second state so as to support the warped silicon carbide wafer. The gas pipeline is arranged on the fixed seat and supports and guides the silicon carbide wafer which tends to be flat along with softening of the fixed seat, and a preset distance is arranged between the fixed seat and the gas pipeline so as to be configured to etch the