Chip memory splitting method and device, equipment and medium
The invention discloses a chip memory splitting method, apparatus and device, and a medium. The method comprises the steps of obtaining a length-width ratio demand and a size demand of a memory; traversing all memory compiler configuration items, and splitting according to each configuration item; a...
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Format | Patent |
Language | Chinese English |
Published |
02.05.2023
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Abstract | The invention discloses a chip memory splitting method, apparatus and device, and a medium. The method comprises the steps of obtaining a length-width ratio demand and a size demand of a memory; traversing all memory compiler configuration items, and splitting according to each configuration item; and comparing all splitting results to obtain an optimal solution. The memory split by the invention not only can meet the lowest chip tape-out cost, but also can meet the lowest chip layout and wiring difficulty.
本发明公开了芯片存储器拆分方法、装置、设备及介质,所述方法包括:获取存储器长宽比例需求和大小需求;遍历所有存储器编译器配置项,按照每个配置项进行拆分;对全部拆分结果进行比较后得到最优解。本发明拆分出的存储器既能满足芯片流片成本最低,又能满足芯片布局布线难度最低。 |
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AbstractList | The invention discloses a chip memory splitting method, apparatus and device, and a medium. The method comprises the steps of obtaining a length-width ratio demand and a size demand of a memory; traversing all memory compiler configuration items, and splitting according to each configuration item; and comparing all splitting results to obtain an optimal solution. The memory split by the invention not only can meet the lowest chip tape-out cost, but also can meet the lowest chip layout and wiring difficulty.
本发明公开了芯片存储器拆分方法、装置、设备及介质,所述方法包括:获取存储器长宽比例需求和大小需求;遍历所有存储器编译器配置项,按照每个配置项进行拆分;对全部拆分结果进行比较后得到最优解。本发明拆分出的存储器既能满足芯片流片成本最低,又能满足芯片布局布线难度最低。 |
Author | QIN SILIN XU CONG LI WEI |
Author_xml | – fullname: LI WEI – fullname: QIN SILIN – fullname: XU CONG |
BookMark | eNrjYmDJy89L5WSwdc7ILFDITc3NL6pUKC7IySwpycxLBwqUZOSnKCTmpSikpJZlJqfqKKQWlmYW5KbmlYBFc1NTMktzeRhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoaGZgamBsZGFozExagAY6jGt |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences Physics |
DocumentTitleAlternate | 芯片存储器拆分方法、装置、设备及介质 |
ExternalDocumentID | CN116050328A |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_CN116050328A3 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 13:12:31 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | Chinese English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_CN116050328A3 |
Notes | Application Number: CN202211725019 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230502&DB=EPODOC&CC=CN&NR=116050328A |
ParticipantIDs | epo_espacenet_CN116050328A |
PublicationCentury | 2000 |
PublicationDate | 20230502 |
PublicationDateYYYYMMDD | 2023-05-02 |
PublicationDate_xml | – month: 05 year: 2023 text: 20230502 day: 02 |
PublicationDecade | 2020 |
PublicationYear | 2023 |
RelatedCompanies | CHENGDU DIANKE XINGTUO TECHNOLOGY CO., LTD |
RelatedCompanies_xml | – name: CHENGDU DIANKE XINGTUO TECHNOLOGY CO., LTD |
Score | 3.5972953 |
Snippet | The invention discloses a chip memory splitting method, apparatus and device, and a medium. The method comprises the steps of obtaining a length-width ratio... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS |
Title | Chip memory splitting method and device, equipment and medium |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230502&DB=EPODOC&locale=&CC=CN&NR=116050328A |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_m_HzTqej8IIL0yWKbbl33UMSlG0NYN2TK3kabpqzCumpbRP96L3FzvuhbuMCRXLjLJfe7O4Br0XZsOxKBjq54LH-ruB4YguqxybnVNiNhCJngPPDt_lPjYdKcVOBllQuj6oS-q-KIqFEc9b1Q9jpbf2J5CluZ34YJkhZ3vbHracvXMfrTTYNqXsftjobekGmMuczX_EfXNG1Z-YQ69xuwiW50S2pD97kjs1Ky31dKbx-2RsgtLQ6g8jmrwS5bdV6rwc5gGfCuwbZCaPIciUstzA_BZbMkI3OJkf0gOXqRCrtMvptBkyCNSCSkAbgh4rVMFCBIUWUcvZwfwVWvO2Z9HVc0_dn-lPnrxVvHUE0XqTgBEuBDweIW5UaTNlqO5cQ4xvPgdmhRU7RPof43n_p_k2ewJ0WpYH30HKrFWyku8Ootwkslsy8UTIgD |
link.rule.ids | 230,309,783,888,25576,76876 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT8IwEL8gfuCbokbxqyZmTy5uHRvjYTHSQVBhEIOGNzK6EjBhoNti9K_3WkF80bfmmlzaa-567f3uDuBSVF3HiUSooys-kr9VXA8NQfWRyblVNSNhCJng3A6c5lP5vm_3c_CyzIVRdULfVXFE1CiO-p4qez1ffWL5CluZXA8nSJrdNHqery1ex-hP2wbV_JpX73b8DtMY81igBY-eaTqy8gl1b9dgHV3sitSG-nNNZqXMf18pjR3Y6CK3ON2F3Oe4CAW27LxWhK32IuBdhE2F0OQJEhdamOyBx8aTOZlKjOwHSdCLVNhl8t0MmoRxRCIhDcAVEa_ZRAGCFFXG0bPpPlw06j3W1HFFg5_tD1iwWrx1APl4FotDICHuwuIW5YZNyxXXckc4xvPgztCipqgeQelvPqX_Js-h0Oy1W4PWXfBwDNtSrAriR08gn75l4hSv4XR4puT3BaFEivY |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Chip+memory+splitting+method+and+device%2C+equipment+and+medium&rft.inventor=LI+WEI&rft.inventor=QIN+SILIN&rft.inventor=XU+CONG&rft.date=2023-05-02&rft.externalDBID=A&rft.externalDocID=CN116050328A |