WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

The invention provides a wiring board and a method for manufacturing the wiring board, so that the thickness of a conductor layer embedded in an insulating layer in a printed wiring board is precisely controlled. A method of manufacturing a wiring board according to an embodiment includes: forming a...

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Bibliographic Details
Main Authors ADACHI TAKEMA, IGAWA YUJI
Format Patent
LanguageChinese
English
Published 14.04.2023
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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