WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

• Main Authors: ADACHI TAKEMA, IGAWA YUJI
• Format: Patent
• Language: Chinese; English
• Published: 14.04.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention provides a wiring board and a method for manufacturing the wiring board, so that the thickness of a conductor layer embedded in an insulating layer in a printed wiring board is precisely controlled. A method of manufacturing a wiring board according to an embodiment includes: forming a first resin insulating layer (111) and a second resin insulating layer (112) in contact with an upper surface of the first resin insulating layer (111); recessed portions (op1, op2) penetrating the second resin insulating layer (112) and exposing the first resin insulating layer (111) at the bottom are formed by irradiation of the laser light; and filling the recesses (op1, op2) with a conductor to form a first conductor layer (121) having a form embedded in the second resin insulating layer (112). The first resin insulating layer (111) and the second resin insulating layer (112) have different processability with respect to laser light. 本发明提供布线基板和布线基板的制造方法，使得在印刷布线板中，具有埋入于绝缘层内的形态的导体层的厚度被精密地控制。实施方式的布线基板的制造方法包含如下步骤：