Core substrate and package structure

• Main Authors: KIM DO-WON, LIM KYO-MOOK, SON JANG-BAE, HONG MYUNG-HO, YOON SUK-WOO
• Format: Patent
• Language: Chinese; English
• Published: 07.04.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A core substrate and a package structure are provided. The package structure includes: a core substrate including a substrate base including a plurality of first cavities and a plurality of second cavities, a plurality of blocks in the plurality of second cavities, and a plurality of bridge structures extending between each of the plurality of blocks and the substrate base; the plurality of semiconductor chips are positioned in the plurality of first cavities; and a molding layer configured to cover the core substrate and the plurality of semiconductor chips, a portion of the molding layer being located in the plurality of first cavities and the plurality of second cavities. 提供了芯基底和封装结构。所述封装结构包括：芯基底，包括包含多个第一空腔和多个第二空腔的基底基体、位于所述多个第二空腔中的多个块以及在所述多个块中的每个与基底基体之间延伸的多个桥结构；多个半导体芯片，位于所述多个第一空腔中；以及模制层，被构造为覆盖芯基底和所述多个半导体芯片，模制层的一部分位于所述多个第一空腔和所述多个第二空腔中。