Curing agent as well as preparation method and application thereof

The invention discloses a curing agent as well as a preparation method and application thereof. The curing agent is obtained by reacting a diisocyanate and a polyalkylene ether glycol in the presence of a disulfide bond-containing compound and a ketimine compound. The curing agent contains dynamic c...

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Bibliographic Details
Main Authors SHENG XINGYUE, WEI KUILING, SHAN BAILIN, LI LU, CAO XUEJUAN, HAO ZENGHENG, WU YAN
Format Patent
LanguageChinese
English
Published 07.04.2023
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:The invention discloses a curing agent as well as a preparation method and application thereof. The curing agent is obtained by reacting a diisocyanate and a polyalkylene ether glycol in the presence of a disulfide bond-containing compound and a ketimine compound. The curing agent contains dynamic covalent bonds, and self-repairing epoxy resin can be prepared by mixing the curing agent with common epoxy resin. 本发明公开了一种固化剂及其制备方法和用途。该固化剂是通过将二异氰酸酯和聚亚烷基醚二醇在含双硫键化合物和酮亚胺化合物的存在下反应得到的。本发明的固化剂含有动态共价键，将其与普通环氧树脂混合可制备得到自修复环氧树脂。
Bibliography:Application Number: CN202310032739