Switching device, test system and test method

• Main Authors: SHI PAN, HUO JUNJUN
• Format: Patent
• Language: Chinese; English
• Published: 28.03.2023
• Subjects: MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; TESTING

The embodiment of the invention relates to the technical field of chip testing, and provides a switching device, a testing system and a testing method. Wherein the switching device is used for switching a chip to be tested to a mainboard. The switching device comprises a first test board, a second test board, a cable and a probe. The first test board comprises first bonding pads and test bonding pads, wherein the first bonding pads are used for being electrically connected with functional pins of the chip to be tested in a one-to-one correspondence mode, and the test bonding pads are electrically connected with the first bonding pads. The second test board and the first test board are electrically connected through the cable. And in two opposite ends of the probe, one end is fixed and electrically connected with the second test board, and the other end is used for being electrically connected with the mainboard. 本申请实施例涉及芯片测试技术领域，并提供一种转接装置、测试系统及测试方法。其中，所述转接装置用于将待测芯片转接至主板上。所述转接装置包括第一测试板、第二测试板、线缆以及探针。所述第一测试板包括用于