Acid sulfate electronic copper electroplating additive composition and application thereof

• Main Authors: YANG FANGZU, WANG ZHAOYUN, YANG JIAQIANG, SUN SHIGANG, JIN LEI
• Format: Patent
• Language: Chinese; English
• Published: 14.03.2023
• Subjects: APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The invention discloses an acid sulfate electronic copper electroplating additive composition and application thereof. The acid sulfate electronic copper electroplating additive composition is composed of a carrier stopping agent, a refining agent and a uniform plating agent according to the mass ratio of (100-800): (0.5-10): (0.5-20). Within the use condition range, the surface tension of the plating solution can be effectively reduced, copper layer particles are refined, the deposition current efficiency is improved, compact filling of the blind holes of the PCB is achieved, the surface copper thickness is small, compact filling of the blind holes with the hole diameter being 100 micrometers and the hole depth being 50 micrometers can be achieved, the surface flatness is extremely good, and the copper layer thickness can be lower than 15 micrometers. 本发明公开了一种酸性硫酸盐电子电镀铜添加剂组合物及其应用，由载体阻化剂、细化剂和均镀剂以100-800∶0.5-10∶0.5-20的质量比组成。本发明在使用条件范围内，能够有效降低镀液表面张力，细化铜层颗粒，提高沉积电流效率，实现PCB盲孔的致密填充且面铜厚度薄，可实现孔径100μm且孔深50μm的盲孔致密填充、表面