Three-dimensional memory, preparation method thereof and memory system
The embodiment of the invention provides a three-dimensional memory, a manufacturing method thereof and a memory system. The three-dimensional memory includes: a semiconductor layer; the stacked structure is located on one side of the semiconductor layer; the channel structure penetrates through the...
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| Main Author | |
|---|---|
| Format | Patent |
| Language | Chinese English |
| Published |
07.03.2023
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| Subjects | |
| Online Access | Get full text |
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