Semiconductor device and forming method thereof
In an embodiment, a semiconductor device includes a first gate dielectric on a first channel region of a first semiconductor component; a first gate electrode on the first gate dielectric; a second gate dielectric on a second channel region of the second semiconductor component, the second gate diel...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
03.03.2023
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Subjects | |
Online Access | Get full text |
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Summary: | In an embodiment, a semiconductor device includes a first gate dielectric on a first channel region of a first semiconductor component; a first gate electrode on the first gate dielectric; a second gate dielectric on a second channel region of the second semiconductor component, the second gate dielectric having a greater crystallinity than the first gate dielectric; and a second gate electrode on the second gate dielectric. The embodiment of the invention also provides a method for forming the semiconductor device.
在实施例中,半导体器件包括:第一半导体部件的第一沟道区上的第一栅极电介质;第一栅极电介质上的第一栅电极;第二半导体部件的第二沟道区上的第二栅极电介质,第二栅极电介质具有比第一栅极电介质大的结晶度;以及第二栅电介质上的第二栅电极。本发明的实施例还提供了形成半导体器件的方法。 |
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Bibliography: | Application Number: CN202210684086 |