Preparation process of soldering paste

• Main Authors: XIAO HANFEI, LIU JIANCHAO, XIAO DAWEI, XIAO JIAN
• Format: Patent
• Language: Chinese; English
• Published: 03.02.2023
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention discloses a preparation technology of soldering paste, and belongs to the technical field of soldering paste preparation, the soldering paste is formed by mixing solder powder, an activating agent, a thixotropic agent, a resin agent and an organic solvent, and the parts of all the components are as follows: 20-30 parts of the solder powder, 5-8 parts of the activating agent, 2-3 parts of the thixotropic agent, 3-4 parts of the resin agent and 5-9 parts of the organic solvent; all the raw materials are weighed according to the component proportion, the resin agent is added into a mixing barrel to be heated to 140 DEG C to 150 DEG C, the activating agent and the organic solvent are added, the mixture extends into the mixing barrel through a stirring device to be stirred and mixed to be uniform, after the mixture is cooled to 40 DEG C to 60 DEG C, the thixotropic agent is added, and the mixture is stirred and mixed to be uniform again to obtain the paste flux; adding the solder powder into the past