LASER CONTROL STRUCTURE AND LASER JOINING METHOD USING THE SAME

• Main Authors: CHOI GWANG-MOON, EOM YONG SUNG, ZHU ZHIHAO, LI WEI, CHANG, KI-SEOK, CHOI KWANG-SUNG, MOON SEOKHWAN
• Format: Patent
• Language: Chinese; English
• Published: 06.01.2023
• Subjects: ADHESIVES; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; DYES; MACHINE TOOLS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PERFORMING OPERATIONS; POLISHES; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SOLDERING OR UNSOLDERING; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING; WELDING; WORKING BY LASER BEAM

Provided are a laser control structure and a laser bonding method using the same, the laser bonding method including: forming a bonding portion on a substrate; disposing a joining object on the joining portion; arranging a laser control structure on the bonding object or the substrate; irradiating laser light to the joining object and the joining part; controlling the amount of laser absorbed by the laser control structure; heating the bonding portion and the bonding object to a bonding temperature using a controlled amount of laser; and joining the joining part and the joining object. The laser control structure includes a first substrate including a first region and a second region; a first film laminate on the first region; and a second film laminate on the second region. The first film laminate comprises at least one first film layer and at least one second film layer; the second film laminate comprises at least one third film layer and at least one fourth film layer; the first film laminate and the secon