Micromechanical device with contact pads

The invention relates to a micromechanical device, comprising a MEMS substrate (10), which surrounds at least one first cavity (60), and a cover substrate (20), comprising at least one contact pad (40), which is arranged outside the first cavity, a MEMS structure (30) being arranged in the first cav...

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Bibliographic Details
Main Authors REINMUTH JOCHEN, RAMBACH MARTIN
Format Patent
LanguageChinese
English
Published 18.11.2022
Subjects
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
TRANSPORTING
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Summary:The invention relates to a micromechanical device, comprising a MEMS substrate (10), which surrounds at least one first cavity (60), and a cover substrate (20), comprising at least one contact pad (40), which is arranged outside the first cavity, a MEMS structure (30) being arranged in the first cavity and being connected to the contact pad by means of a conductor path (50), the printed conductor at least partially extends in the MEMS substrate. The core of the invention is that the contact pads are arranged on the surface of the cover substrate. 本发明基于一种微机械设备，所述微机械设备具有包围至少一个第一腔体(60)的MEMS衬底(10)和盖衬底(20)，所述微机械设备具有布置在所述第一腔体外部的至少一个接触垫(40)，其中，MEMS结构(30)布置在所述第一腔体中并且借助印制导线(50)与所述接触垫连接，其中，所述印制导线至少部分地在所述MEMS衬底中延伸。本发明的核心在于，所述接触垫布置在所述盖衬底的表面上。
Bibliography:Application Number: CN202210533674