Integrated circuit and forming method thereof
An integrated circuit and a method of forming the same are provided. In one embodiment, an integrated circuit includes a first nanostructure transistor including: a plurality of first semiconductor nanostructures over a substrate; and a source/drain region in contact with each of the first semicondu...
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Main Authors | , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
15.11.2022
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Subjects | |
Online Access | Get full text |
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Summary: | An integrated circuit and a method of forming the same are provided. In one embodiment, an integrated circuit includes a first nanostructure transistor including: a plurality of first semiconductor nanostructures over a substrate; and a source/drain region in contact with each of the first semiconductor nanostructures. The integrated circuit includes a second nanostructure transistor including: a plurality of second semiconductor nanostructures; and a second source/drain region in contact with the one or more second semiconductor nanostructures, but not in contact with the one or more other second semiconductor nanostructures.
本发明的实施例提供了集成电路及其形成方法。集成电路包括第一纳米结构晶体管,第一纳米结构晶体管包括:多个第一半导体纳米结构,位于衬底上方;和源极/漏极区,与每个第一半导体纳米结构接触。集成电路包括第二纳米结构晶体管,第二纳米结构晶体管包括:多个第二半导体纳米结构;和第二源极/漏极区,与一个或者多个第二半导体纳米结构接触,但是不与一个或者多个其他第二半导体纳米结构接触。 |
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Bibliography: | Application Number: CN202210719174 |