Low-density polyurethane hot melt adhesive and preparation method thereof

• Main Authors: LIU BIN, WU SHINAN, CAO XUE, LIU LIZHONG, WANG ZIPING, HE CHANGSHENG
• Format: Patent
• Language: Chinese; English
• Published: 11.11.2022
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

The invention discloses a low-density polyurethane hot melt adhesive and a preparation method thereof, and the hot melt adhesive is prepared from the following raw materials in parts by weight: 9-20 parts of isocyanate, 20-45 parts of polyether glycol, 10-40 parts of thermoplastic acrylic resin, 10-...