Ejection device and method

• Main Authors: CHEN TAO, YANG PENG, DING YONGWANG, ZHA RUIHAO
• Format: Patent
• Language: Chinese; English
• Published: 04.11.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses an ejecting and separating device and method. The ejecting and separating device comprises a carrier, an adhesive tape, a suction nozzle structure and a heating module. The adhesive tape is positioned on one side of the carrier and is used for bonding a product; the heating module is located on the side, away from the adhesive tape, of the carrier and used for heating the adhesive tape. The suction nozzle structure is used for sucking the product. According to the ejection device and method, glue can be prevented from remaining on the back face of a product, and the success rate of sucking the product by the suction nozzle structure can be increased. 本发明公开了一种顶离装置和方法，顶离装置包括：载具、胶带、吸嘴结构和加热模块；所述胶带位于所述载具的一侧，所述胶带用于粘接产品；所述加热模块位于所述载具远离所述胶带的一侧，所述加热模块用于加热所述胶带；所述吸嘴结构用于吸取所述产品。本发明提供了一种顶离装置和方法，可以避免胶水残留产品背面，也可以提高吸嘴结构吸取产品的成功率。