Component for plasma processing apparatus, method for manufacturing same, and plasma processing apparatus

This member (10, 22) for a plasma processing device is characterized by having a base material (12, 23) and a heat-conducting layer (13, 24) provided on one surface of the base material, and the heat-conducting layer (13, 24) contains at least one of a fluorine-based resin and a fluorine-based elast...

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Main Authors KATASE TAKUMA, SHIONO ICHIRO, KURATA YUTO, ISHIKAWA FUMIAKI, YASOSHIMA TSUKASA
Format Patent
LanguageChinese
English
Published 14.10.2022
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Abstract This member (10, 22) for a plasma processing device is characterized by having a base material (12, 23) and a heat-conducting layer (13, 24) provided on one surface of the base material, and the heat-conducting layer (13, 24) contains at least one of a fluorine-based resin and a fluorine-based elastomer. 该等离子体处理装置用部件(10,22)的特征在于,具有基材(12,23)和设置在所述基材的一面的导热层(13,24),所述导热层(13,24)包含氟系树脂及氟系弹性体中的至少一者。
AbstractList This member (10, 22) for a plasma processing device is characterized by having a base material (12, 23) and a heat-conducting layer (13, 24) provided on one surface of the base material, and the heat-conducting layer (13, 24) contains at least one of a fluorine-based resin and a fluorine-based elastomer. 该等离子体处理装置用部件(10,22)的特征在于,具有基材(12,23)和设置在所述基材的一面的导热层(13,24),所述导热层(13,24)包含氟系树脂及氟系弹性体中的至少一者。
Author KATASE TAKUMA
SHIONO ICHIRO
YASOSHIMA TSUKASA
ISHIKAWA FUMIAKI
KURATA YUTO
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DocumentTitleAlternate 等离子体处理装置用部件和其制造方法及等离子体处理装置
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Snippet This member (10, 22) for a plasma processing device is characterized by having a base material (12, 23) and a heat-conducting layer (13, 24) provided on one...
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SubjectTerms BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
PLASMA TECHNIQUE
PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS
PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS
SEMICONDUCTOR DEVICES
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Title Component for plasma processing apparatus, method for manufacturing same, and plasma processing apparatus
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