SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

• Main Authors: LIN BAIYAO, YE SHUSHEN, XU JIAGUI, YOU MINGZHI, ZHENG XINPU
• Format: Patent
• Language: Chinese; English
• Published: 09.08.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor package includes an encapsulated semiconductor device and a redistribution structure. An encapsulated semiconductor device includes a semiconductor device encapsulated by an encapsulation material. The redistribution structure overlies the encapsulated semiconductor device and includes a plurality of vias and redistribution lines. A plurality of vias are respectively located on different layers of the redistribution structure and are connected to each other by a plurality of conductive lines, where an included angle between adjacent two of the plurality of conductive lines is greater than zero when viewed from a top view. A redistribution line is disposed under the plurality of conductive lines and connects a corresponding one of the plurality of vias, and is electrically connected to the semiconductor device through the plurality of vias. 本发明实施例提供一种半导体封装，包含包封半导体器件和重布线结构。包封半导体器件包含由包封材料包封的半导体器件。重布线结构上覆于包封半导体器件且包含多个通孔和重布线。多个通孔分别位于重布线结构的不同层上且通过多个导电线彼此连接，其中从俯视图看，多个导电线中的相邻两个之间所夹的角度大于零。重布线设置在多个导电线之下