Debondable pressure sensitive adhesives and uses thereof
The present invention relates to debondable on demand pressure sensitive adhesive and laminating adhesive compositions and uses thereof. The debondable pressure sensitive adhesive and lamination adhesive are applied to a substrate to form an adhesion, and the adhesive can peel from the substrate upo...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
29.07.2022
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Subjects | |
Online Access | Get full text |
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Abstract | The present invention relates to debondable on demand pressure sensitive adhesive and laminating adhesive compositions and uses thereof. The debondable pressure sensitive adhesive and lamination adhesive are applied to a substrate to form an adhesion, and the adhesive can peel from the substrate upon exposure to an electron beam or ultraviolet light energy source. The debondable pressure sensitive adhesives and laminating adhesives are particularly suitable for recovery in circular economy.
本发明涉及按需可脱粘压敏粘合剂和层合粘合剂组合物及其用途。将所述可脱粘压敏粘合剂和层合粘合剂施用于基材上以形成粘合,并且在暴露于电子束或紫外光能源时,粘合剂可以从基材上剥离。可脱粘压敏粘合剂和层合粘合剂特别适用于循环经济中的回收。 |
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AbstractList | The present invention relates to debondable on demand pressure sensitive adhesive and laminating adhesive compositions and uses thereof. The debondable pressure sensitive adhesive and lamination adhesive are applied to a substrate to form an adhesion, and the adhesive can peel from the substrate upon exposure to an electron beam or ultraviolet light energy source. The debondable pressure sensitive adhesives and laminating adhesives are particularly suitable for recovery in circular economy.
本发明涉及按需可脱粘压敏粘合剂和层合粘合剂组合物及其用途。将所述可脱粘压敏粘合剂和层合粘合剂施用于基材上以形成粘合,并且在暴露于电子束或紫外光能源时,粘合剂可以从基材上剥离。可脱粘压敏粘合剂和层合粘合剂特别适用于循环经济中的回收。 |
Author | WALTER PABLO NOWICKI JAMES |
Author_xml | – fullname: WALTER PABLO – fullname: NOWICKI JAMES |
BookMark | eNrjYmDJy89L5WSwcElNys9LSUzKSVUoKEotLi4tSlUoTs0rzizJLEtVSEzJSC0GMooVEvNSFEqLgYySjNSi1Pw0HgbWtMSc4lReKM3NoOjmGuLsoZtakB-fWlyQmJyal1oS7-xnaGhiYWRpamTsaEyMGgA-mDBy |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
DocumentTitleAlternate | 可脱粘压敏粘合剂及其用途 |
ExternalDocumentID | CN114829523A |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_CN114829523A3 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 13:04:50 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | Chinese English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_CN114829523A3 |
Notes | Application Number: CN202180006741 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220729&DB=EPODOC&CC=CN&NR=114829523A |
ParticipantIDs | epo_espacenet_CN114829523A |
PublicationCentury | 2000 |
PublicationDate | 20220729 |
PublicationDateYYYYMMDD | 2022-07-29 |
PublicationDate_xml | – month: 07 year: 2022 text: 20220729 day: 29 |
PublicationDecade | 2020 |
PublicationYear | 2022 |
RelatedCompanies | HENKEL AG & CO. KGAA |
RelatedCompanies_xml | – name: HENKEL AG & CO. KGAA |
Score | 3.5356512 |
Snippet | The present invention relates to debondable on demand pressure sensitive adhesive and laminating adhesive compositions and uses thereof. The debondable... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES TRANSPORTING USE OF MATERIALS AS ADHESIVES |
Title | Debondable pressure sensitive adhesives and uses thereof |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220729&DB=EPODOC&locale=&CC=CN&NR=114829523A |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3fS8MwED7mFPVNp6LzBxWkb0WXdXV9KOLSliGsGzJlbyNZUqZIO9YWwb_eu7A5X_QtJHAkgbvcl3z3BeBGCl-6WhCnylOOKz3myFY6cxA7K8wg7pgwFd6DxOu_uE-TzqQG7-taGKMT-mnEEdGjZujvpYnXi80lVmi4lcWtfMOu_CEeB6G9QseMkRC2HfaCaDQMh9zmPOCJnTwHlPYzH1HX4xZsk-wW6exHrz2qSln8PlLiA9gZobWsPITa17wBe3z981oDdgerB29srnyvOIIuhQYE0PJDW4a9Wi21VRD_nCKWJdRcExW9sESmrKrABuV2Ok-P4TqOxrzv4BSmP-ud8mQz2_YJ1LM806dgaSGk8jTiD9VxVRczDemLmVAsFWnaYvdn0PzbTvO_wXPYp72jK0vmX0C9XFb6Es_aUl6ZTfoGyR2EbQ |
link.rule.ids | 230,308,780,885,25564,76547 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3fS8MwED7mFOebTkXnrwrSt6KLXbc-FHHpxtStGzJlbyNpUqZIN9YOwb_eu7A5X_QtJBCSwF2-L_nuDuBKCl-6WpCmylOOKz3myGoSO8idFSKIGyZMhHcv8jov7uOoNirA-yoWxuQJ_TTJEdGiYrT33Pjr2foRKzTayuxavmHX9K49DEJ7yY4Zo0TYdtgMWoN-2Oc25wGP7Og5INjPfGRd9xuwWaeKuwSdXpsUlTL7faW0d2FrgLOl-R4UviZlKPFV5bUybPeWH97YXNpetg8Ncg1IoOWHtox6dTHXVkb6c_JYllATTVL0zBKpshYZNgjb6WlyAJft1pB3HFzC-Ge_Yx6tV3t7CMV0muojsLQQUnka-YequaqBSEP6IhaKJSJJqqx-DJW_56n8N3gBpc6w1x13H6KnE9ihc6TnS-afQjGfL_QZ3ru5PDcH9g0npYde |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Debondable+pressure+sensitive+adhesives+and+uses+thereof&rft.inventor=WALTER+PABLO&rft.inventor=NOWICKI+JAMES&rft.date=2022-07-29&rft.externalDBID=A&rft.externalDocID=CN114829523A |