Debondable pressure sensitive adhesives and uses thereof

The present invention relates to debondable on demand pressure sensitive adhesive and laminating adhesive compositions and uses thereof. The debondable pressure sensitive adhesive and lamination adhesive are applied to a substrate to form an adhesion, and the adhesive can peel from the substrate upo...

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Bibliographic Details
Main Authors WALTER PABLO, NOWICKI JAMES
Format Patent
LanguageChinese
English
Published 29.07.2022
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Online AccessGet full text

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Summary:The present invention relates to debondable on demand pressure sensitive adhesive and laminating adhesive compositions and uses thereof. The debondable pressure sensitive adhesive and lamination adhesive are applied to a substrate to form an adhesion, and the adhesive can peel from the substrate upon exposure to an electron beam or ultraviolet light energy source. The debondable pressure sensitive adhesives and laminating adhesives are particularly suitable for recovery in circular economy. 本发明涉及按需可脱粘压敏粘合剂和层合粘合剂组合物及其用途。将所述可脱粘压敏粘合剂和层合粘合剂施用于基材上以形成粘合,并且在暴露于电子束或紫外光能源时,粘合剂可以从基材上剥离。可脱粘压敏粘合剂和层合粘合剂特别适用于循环经济中的回收。
Bibliography:Application Number: CN202180006741