Multi-laser splicing scanning path planning method and multi-laser splicing scanning method

• Main Authors: PENG DONGJIAN, BAI RUIXING, LI DIAN, WANG YUN, YANG HUANQING, BAI JING
• Format: Patent
• Language: Chinese; English
• Published: 12.07.2022
• Subjects: ADDITIVE MANUFACTURING TECHNOLOGY; ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING; CASTING; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; PERFORMING OPERATIONS; POWDER METALLURGY; TRANSPORTING; WORKING METALLIC POWDER

The invention discloses a multi-laser splicing scanning path planning method. The method comprises the steps that a to-be-formed area is divided into an independent scanning area and a multi-laser overlapping and splicing area; the standard size of a subdivision scanning unit used for filling the multi-laser overlapping and splicing area is determined, and the filling rule of the subdivision scanning unit in the multi-laser overlapping and splicing area is determined according to the size of the multi-laser overlapping and splicing area and the standard size of the subdivision scanning unit; determining an in-layer scanning sequence of each laser in each multi-laser overlapping and splicing area; performing intra-layer scanning strategy planning of a multi-laser overlapping and splicing area, and generating an intra-layer remelting unit from a subdivision scanning unit; and carrying out interlayer scanning strategy planning on a multi-laser coincident splicing area, and generating an interlayer remelting unit