Manufacturing method of semiconductor lead frame etching equipment

• Main Authors: KADOMATSU MEIJU, ZHOU AIHE
• Format: Patent
• Language: Chinese; English
• Published: 08.07.2022
• Subjects: APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SEMICONDUCTOR DEVICES

The invention belongs to the technical field of semiconductor integrated circuit lead frame etching manufacturing, and particularly relates to a manufacturing method of semiconductor lead frame etching equipment and a method for producing and processing a precise semiconductor lead frame through the semiconductor lead frame etching equipment. The method specifically comprises the following steps of: cleaning a copper alloy material, roughening the surface of the copper alloy material, laminating the material and a photosensitive dry film, exposing the material subjected to film lamination through a mask plate by adopting laser equipment, developing, etching, demolding, and performing various electrolytic metal processes. According to the semiconductor lead frame etching production and manufacturing equipment, a feasible production and manufacturing technology is provided for preparing and processing a complex and precise semiconductor lead frame; the semiconductor lead frame with the surface roughness, which