Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating

• Main Authors: DONG ZHAOKAI, TORRENTS ABAD OSCAR, ZHAO ZHENGSONG, ENGARTY, DINISON, SENGUR, ALI, DE LILLE, R, SAKTI, POJA, BRODOSEANU, DANIEL, WU ZHENBANG, FARRENS SHARI
• Format: Patent
• Language: Chinese; English
• Published: 07.06.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The object of the present invention is an enhanced system and method for electrically coupling, bonding and/or securing electrical contacts of a semiconductor device to electrical contacts of other semiconductor devices using a pulse-triggered photon (or EM energy) source (e.g., but not limited to a...