Epoxy resin composition for encapsulating semiconductor device and semiconductor device

• Main Authors: WASHIMI NORIYUKI, PARK YONG YEOP, LEE, CHOL HO, BAE KYOUNG CHUL, LEE DONG HWAN
• Format: Patent
• Language: Chinese; English
• Published: 06.05.2022
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The present invention provides an epoxy resin composition for encapsulating a semiconductor device and a semiconductor device encapsulated using the same. The epoxy resin composition includes an epoxy resin, a curing agent, an inorganic filler, and a curing catalyst, wherein the epoxy resin includes an epoxy resin represented by Formula 1. In the formula 1, each substituent group is defined in the specification. [Formula 1]. 本发明提供一种用于囊封半导体器件的环氧树脂组合物和一种使用其囊封的半导体器件。环氧树脂组合物包含环氧树脂、固化剂、无机填充剂以及固化催化剂，其中环氧树脂包含由式1表示的环氧树脂。在式1中，每一取代基的定义同说明书中所述。[式1]。