Substrate design method for preventing bottom filling glue from overflowing

• Main Authors: CHENG LANG, CHEN YONG, RAO XILIN, ZHANG YI, YANG DAE-JONG, CAI ZEXIAN
• Format: Patent
• Language: Chinese; English
• Published: 26.04.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a substrate design method for preventing bottom filling glue from overflowing, which comprises the following steps: a retaining wall is arranged on a substrate, the retaining wall is positioned outside a chip, and a glue injection area is reserved between the retaining wall and the chip. In order to prevent the bottom filling glue from overflowing, the retaining wall is arranged on the substrate, the retaining wall adopts a fixed design, the chip is welded in the annular closed retaining wall during bumping, and then glue injection is carried out by a glue gun through a glue injection area between the retaining wall and the chip, so that the chip is prevented from overflowing. Under the action of a capillary phenomenon, the glue solution can fill a bump area below the chip and diffuse outwards, then the glue solution is intercepted by the retaining wall, as the retaining wall is located between the top and the bottom of the chip, the overflowing glue solution can be shielded by the ret