Wafer cleaning device

• Main Authors: SHEN QILIANG, LIAO SHIRONG, YE JINLIN
• Format: Patent
• Language: Chinese; English
• Published: 15.04.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CLEANING; CLEANING IN GENERAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; PREVENTION OF FOULING IN GENERAL; SEMICONDUCTOR DEVICES; TRANSPORTING

The invention discloses a wafer cleaning device. The wafer cleaning device comprises a support; the three shafts are installed on the support in parallel, two of the three shafts are located on the two sides of the other shaft, and the three shafts are located above the other shaft; at least one shaft can change the distance between the at least one shaft and at least one of the other two shafts; the three shafts are respectively provided with a limiting groove used for being matched with a wafer. And the wafer is placed in the limiting grooves of the three shafts to support the wafer, so that the wafer is convenient to clean. And the distances among the three shafts can be changed, so that wafers with different diameters can be conveniently placed, and the adaptability is good. 本发明公开了一种晶圆清洗装置，包括：一支架；三个轴，平行安装在所述支架上，其中两个所述轴位于另一所述轴的两侧，并位于另一所述轴的上方；至少一个所述轴能够改变与其它两个所述轴中至少一个的间距；三个所述轴上均设有用于与晶圆相配合的限位槽。将晶圆置于三个轴的限位槽内，支撑晶圆，方便清洗。三个轴之间的间距能够改变，如此，便于放置不同直径的晶圆，适应性好。