Printed circuit board, container, and board housing assembly
A wired circuit board (1) is provided with a metal support layer (2), a base insulating layer (3), and a conductor layer (4) in this order toward the upper side. The peripheral edge of the base insulating layer (3) includes a protruding portion (7) that protrudes outward with respect to the metal su...
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| Main Authors | , , |
|---|---|
| Format | Patent |
| Language | Chinese English |
| Published |
01.04.2022
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A wired circuit board (1) is provided with a metal support layer (2), a base insulating layer (3), and a conductor layer (4) in this order toward the upper side. The peripheral edge of the base insulating layer (3) includes a protruding portion (7) that protrudes outward with respect to the metal support layer (2). The metal support layer (2) has a thickness (T1) of 50 [mu] m or more.
布线电路基板(1)朝向上侧去依次具备金属支承层(2)、基底绝缘层(3)和导体层(4)。基底绝缘层(3)的周缘包含相对于金属支承层(2)向外侧伸出的伸出部分(7)。金属支承层(2)具有50μm以上的厚度(T1)。 |
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| AbstractList | A wired circuit board (1) is provided with a metal support layer (2), a base insulating layer (3), and a conductor layer (4) in this order toward the upper side. The peripheral edge of the base insulating layer (3) includes a protruding portion (7) that protrudes outward with respect to the metal support layer (2). The metal support layer (2) has a thickness (T1) of 50 [mu] m or more.
布线电路基板(1)朝向上侧去依次具备金属支承层(2)、基底绝缘层(3)和导体层(4)。基底绝缘层(3)的周缘包含相对于金属支承层(2)向外侧伸出的伸出部分(7)。金属支承层(2)具有50μm以上的厚度(T1)。 |
| Author | MACHITANI HIROAKI TAKAKURA HAYATO TSUBAI DAIGO |
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| Discipline | Medicine Chemistry Sciences |
| DocumentTitleAlternate | 布线电路基板、容器和基板容纳组件 |
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| Notes | Application Number: CN202080058988 |
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| RelatedCompanies | NAIDONG ELECTRICIAN JOINT-STOCK CONSULTATION |
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| Snippet | A wired circuit board (1) is provided with a metal support layer (2), a base insulating layer (3), and a conductor layer (4) in this order toward the upper... |
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| SubjectTerms | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| Title | Printed circuit board, container, and board housing assembly |
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