Printed circuit board, container, and board housing assembly

A wired circuit board (1) is provided with a metal support layer (2), a base insulating layer (3), and a conductor layer (4) in this order toward the upper side. The peripheral edge of the base insulating layer (3) includes a protruding portion (7) that protrudes outward with respect to the metal su...

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Bibliographic Details
Main Authors TSUBAI DAIGO, TAKAKURA HAYATO, MACHITANI HIROAKI
Format Patent
LanguageChinese
English
Published 01.04.2022
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A wired circuit board (1) is provided with a metal support layer (2), a base insulating layer (3), and a conductor layer (4) in this order toward the upper side. The peripheral edge of the base insulating layer (3) includes a protruding portion (7) that protrudes outward with respect to the metal support layer (2). The metal support layer (2) has a thickness (T1) of 50 [mu] m or more. 布线电路基板(1)朝向上侧去依次具备金属支承层(2)、基底绝缘层(3)和导体层(4)。基底绝缘层(3)的周缘包含相对于金属支承层(2)向外侧伸出的伸出部分(7)。金属支承层(2)具有50μm以上的厚度(T1)。
Bibliography:Application Number: CN202080058988